AGY, a leading U.S. manufacturer of specialty glass fiber products, has introduced L-HDI, a new low coefficient of thermal expansion (CTE) glass fiber designed specifically for advanced packaging substrates and chip packaging in AI hardware. The launch completes AGY s AI-focused glass fiber portfolio, now spanning solutions for semiconductors, high-performance computing, and advanced networking systems.

The new L-HDI glass fiber delivers dimensional stability, thermal reliability, and mechanical integrity required for next-generation AI-specific integrated circuit (IC) packaging, particularly in high-density interconnect (HDI) and substrate core materials.

Patrick Hunter, Executive Vice President, Commercial at AGY, said: With the introduction of L-HDI, AGY now offers a complete portfolio of glass fiber products tailored to AI infrastructure. As AI systems evolve and require more precise, thermally stable materials, AGY is proud to meet this demand with next-generation glass fiber technologies manufactured right here in the United States.

Key Features of AGY s L-HDI Glass Fiber:

• Ultra-low CTE for improved warpage control in IC substrates
• High modulus to resist deformation from heat and stress
• Superior dimensional stability during high thermal cycles
• Optimized for IC substrate manufacturing
• Made in the USA, reinforcing domestic supply chain resilience

With L, L2, and now L-HDI glass fibers, AGY supports a wide spectrum of AI-enabling components, from optical transceivers and high-speed routers to semiconductor packaging and IC substrates.

As global demand for AI infrastructure continues to scale, AGY underscores its commitment to advancing U.S.-made specialty glass fiber technologies, reinforcing its leadership in performance materials for the world s AI-driven digital transformation.

Source: www.agy.com